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CQ08ENL

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SKU: CQ08ENL Categories: Emulation Technology, Test and Measurement Tags: Emulation Technology, Suppliers, Test and Measurement

Description

Description

A specially formulate alloy in wire form designed to melt at the low temperature of 136 degrees F, 58 degrees C.
Prevents damage to the PC board, adjacent components, and the device itself.
Easy clean up and instructions provided.

Technical Specification

Please refer to the datasheet for model specific technical data