• Available for ceramic, plastic BGA and land grid array LGA
• ZIF Lock Socket guarantees contact continuity even under the highest shock and vibration
• Avoid having to solder socket to PCB
• Easily exchange and replace chips with no desoldering required
• Utilizes solder paste or solder flux and industry standard rework stations
• Prevents time-consuming board revisions
• Rapid new design applications
• Customs available upon request

Technical Specification

  • Please refer to the datasheet for model specific technical data