MicroTCA AdvancedMC Backplane Connector

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170-poles high speed signal connector for card edge mount of AMC modules into the backplane.
Data transfer up to 12,5 Gbps.
Internal shielding base for improved performance.
“Eye of the needle press fit contacts.

Technical Specification

Housing Material: Liquid Crystal Polymer LCP, UL 94-V0
Contact Material: Material: Copper alloy.Finish: Mating area Au over Ni. Termination: SN over Ni.
Current Rating IEC 60512: 0,4 A min.
Current Rating: Ground contacts: 0,3 A min.Power contacts: 1,52 A min.Differential pair contacts: 0,1 A min.
Contact Resistance: 25 M Ohm
Insulation Resistance: 100 M Ohm
Differential Impedance: 100 Ohm + / – 10%
Crosstalk: 3% Multi aggressor condition
Differential skew: < 5 ps
Mating Cycles: 200
Mating Force: 100 N max.
Withdrawal Force: 65 N max.