Description
- 170-poles high speed signal connector for card edge mount of AMC modules into the backplane.
- Data transfer up to 12,5 Gbps.
- Internal shielding base for improved performance.
- “Eye of the needle press fit contacts.
Technical Specification
- Housing Material: Liquid Crystal Polymer LCP, UL 94-V0
- Contact Material: Material: Copper alloy.Finish: Mating area Au over Ni. Termination: SN over Ni.
- Current Rating IEC 60512: 0,4 A min.
- Current Rating: Ground contacts: 0,3 A min.Power contacts: 1,52 A min.Differential pair contacts: 0,1 A min.
- Contact Resistance: 25 M Ohm
- Insulation Resistance: 100 M Ohm
- Differential Impedance: 100 Ohm + / – 10%
- Crosstalk: 3% Multi aggressor condition
- Differential skew: < 5 ps
- Mating Cycles: 200
- Mating Force: 100 N max.
- Withdrawal Force: 65 N max.