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CMD/CSD (4 row, high density, signal connector)

CMD/CSD (4 row, high density, signal connector)

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  • High density signal, PCB connector.
  • Number of rows: 4
  • Contact termination: Right angle though board solder, straight through board solder, Flex circuit.
  • Qualifications: MIL-DTL-55302, TPR 02013, ESA ESCC 3401
  • Contact positions: 42, 82, 110, 126, 158, 174, 220, 236,316
  • Offset grid contact layout, four contact rows with dielectic connector body, 1.905mm centre to centre contact spacing in each row and 1.905 row to row spacing.
  • High contact density, low connector weight, low mating force.
  • High shock and vibration proof.
Contact diameter:
0.6mm nominal pin DIA
Contact resistance:
50mΩ maximum
Engagement/withdrawal forces:
0.6N nominal per contact
Contact life cycles:
>30000
Dielectric withstanding voltage.
>750V rms, 60 Hz – sea level
Temperature rating:
-65°C to +125°C
Insulator resistance:
>5 x 103 MΩ at 500V dc
Insulator:
Thermoplastic according to MIL-M-24519 type GST 40F; V-0/5VA per UL 94. ESA SCC 3401 outgassing requirements compliance
Contact:
Material- Brass and BeCu. Plating: Gold Plate
Hardware:
Stainless steel passivated or beryllium-copper alloy nickel plated.

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